Hight Throuahput

By improving Wafer handing mechanism during edge inspection, High throughput isareatly achieved in compared with conventional machines, enabling high-speedinspection of 100 sheets/hour*. The inspection cost (Co0) per Wafer is suppressed andexcellent investment efficiency (ROl) is being performing.
Inspection Quality Result

Unique and clear captured images on this equipment reveal defects existing on thebeve condition. notch part, wafer surface / backside ln addition. bv devising thearrangement of the camera, etc,, the entire surface can be inspected without a deaczone area (non-inspection area).
Numerous achievements and AS Oraanization

We have well achieved number of our svstem delivered and installed in Japan, TaiwanChina. Europe and the United States.We respond to various customer reguests with our technical development capabilitiesand local support that matches customer operations

● Concept

● Hi-throughput and Hi-precisiorWafer Edge, Notch, Surface ancBackside defect inspectionsystem.

● Multiple function of defectinspection into One System.

● Better CoO & Small Space Unit
● Inspection

● 360-degree Edge inspection

● Notch inspection

● BacksideSurface (Only in MS-1100)

● Pinhole (option)

● Pit (option)

● Measurement .Weiaht

● MS-1100:1.850(W)x2,600(D)x2,000(H),App.2,600Kg

● MS-1000: 1.800Wx 2330(D)x2,000(H),App 2200Kg

MS-1100/1000 System lmage